Optoelectronic component, optoelectronic device and method of producing an optoelectronic device

ABSTRACT

An optoelectronic component includes a housing including a base having an upper side and a lower side, and a cap, and a laser chip arranged between the upper side of the base and the cap, wherein a first solder contact pad and a second solder contact pad are formed on the lower side of the base, the laser chip includes a second electrical contact pad, and the second electrical contact pad electrically conductively connects to a section of the base electrically conductively connected to the second solder contact pad by a second bonding wire.

TECHNICAL FIELD

This disclosure relates to an optoelectronic component, anoptoelectronic device, and a method of producing an optoelectronicdevice.

BACKGROUND

Semiconductor-based laser components including housings in which laserdiodes are hermetically sealed for protection from moisture andcontamination are known. It is known to equip the housings of such lasercomponents with wire contacts for push-through installation. The wirecontacts may be inserted into contact openings of a printed circuitboard provided for that purpose and, for example, electrically contactedvia wave soldering. It is known to contact the housings of such lasercomponents additionally via mechanical clamping or bonding to dissipatewaste heat accumulating during operation of the laser component.

It could nonetheless be helpful to provide an improved optoelectroniccomponent, an optoelectronic device and a method of producing anoptoelectronic device.

SUMMARY

We provide an optoelectronic component including a housing including abase having an upper side and a lower side, and a cap, and a laser chiparranged between the upper side of the base and the cap, wherein a firstsolder contact pad and a second solder contact pad are formed on thelower side of the base, the laser chip includes a second electricalcontact pad, and the second electrical contact pad electricallyconductively connects to a section of the base electrically conductivelyconnected to the second solder contact pad by a second bonding wire.

We also provide an optoelectronic device including a printed circuitboard, and the optoelectronic component wherein the optoelectroniccomponent is arranged on a surface of the printed circuit board.

We further provide a method of producing an optoelectronic deviceincluding providing a printed circuit board; providing theoptoelectronic component; and arranging the optoelectronic component ona surface of the printed circuit board.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a base of a housing of an optoelectronic component.

FIG. 2 shows a first view of the housing of the optoelectroniccomponent.

FIG. 3 shows a second view of the housing of the optoelectroniccomponent.

FIG. 4 shows a printed circuit board of an optoelectronic device.

FIG. 5 shows the printed circuit board including optoelectroniccomponents which are arranged on it.

FIG. 6 shows a cross-sectional view of the printed circuit board and theoptoelectronic components of the optoelectronic device.

LIST OF REFERENCE NUMERALS

-   100 Optoelectronic component-   110 Housing-   200 Base-   201 Upper side-   202 Lower side-   210 First solder contact pad-   215 First bonding wire-   220 Second solder contact pad-   225 Second bonding wire-   230 Platform-   235 Chip mounting surface-   240 Carrier-   250 Cavity-   260 Electrically conductive pin-   265 Insulator-   300 Cap-   310 Window-   320 Weld connection-   400 Laser chip-   401 Upper side-   402 Lower side-   410 First electrical contact pad-   420 Second electrical contact pad-   430 Radiation direction-   500 Optoelectronic device-   600 Printed circuit board-   601 Surface-   602 Rear side-   610 First mating contact pad (anode)-   615 First external contact pad-   620 Second mating contact pad (cathode)-   625 Second external contact pad-   630 Series-circuit string

DETAILED DESCRIPTION

Our optoelectronic component includes a housing comprising a base havingan upper side and a lower side, and a cap. In addition, theoptoelectronic component includes a laser chip arranged between theupper side of the base and the cap. A first solder contact pad and asecond solder contact pad are formed on the lower side of the base.Advantageously, this optoelectronic component is suitable for surfaceinstallation. In this case, the first solder contact pad and the secondsolder contact pad of the optoelectronic component may, for example, beelectrically contacted with the aid of reflow soldering. In addition,waste heat may simultaneously be dissipated from the optoelectroniccomponent via the electrically contacted solder contact pads on thelower side of the base of the housing of this optoelectronic component.Advantageously, installation of this optoelectronic component may beautomated with little effort, which makes an economical use of theoptoelectronic component possible in mass-produced devices.

An electrically conductive pin may extend between the upper side and thelower side through the base. In this case, the pin is electricallyinsulated from the remaining sections of the base. In addition, the pinelectrically conductively connects to the first solder contact pad.Advantageously, the pin thereby makes an electrically conductiveconnection from the first solder contact pad on the lower side of thebase to the upper side of the base. In this case, the pin may, forexample, be glazed into the base of the housing of the optoelectroniccomponent.

The laser chip may have a first electrical contact pad. In this case,the first electrical contact pad electrically conductively connects tothe pin with the aid of a first bonding wire. The pin and the firstbonding wire thereby establish an electrically conductive connectionbetween the first solder contact pad on the lower side of the base ofthe housing of the optoelectronic component and the first electricalcontact pad of the laser chip. As a result, the laser chip of theoptoelectronic component may be electrically contacted via the firstsolder contact pad on the lower side of the base of the housing of theoptoelectronic component.

The laser chip may include a second electrical contact pad. In thiscase, the second electrical contact pad electrically conductivelyconnects to a section of the base that electrically conductivelyconnects to the second solder contact pad with the aid of a secondbonding wire. Advantageously, an electrically conductive connectionthereby exists via the base and the second bonding wire between thesecond solder contact pad on the lower side of the base of the housingof the optoelectronic component and the second electrical contact pad ofthe laser chip of the optoelectronic component. As a result, the laserchip may be electrically contacted via the second solder contact pad.

The second solder contact pad may enclose the first solder contact padin a ring-like manner. Advantageously, the first solder contact pad andthe second solder contact pad may thereby jointly occupy a good portionof the area of the lower side of the base of the housing of theoptoelectronic component. As a result, the first solder contact pad andthe second solder contact pad jointly form a large thermal contact padof the optoelectronic component which makes an effective dissipation ofwaste heat from the optoelectronic component possible.

A platform may be formed on the upper side of the base. In this case,the laser chip is arranged on the platform. The platform maysimultaneously be used for the thermal and electrical contacting of thelaser chip. Orientation of the laser chip relative to the lower side ofthe base of the housing of the optoelectronic component may also bedetermined via the shape of the platform.

The laser chip may be situated such that a radiation direction of thelaser chip is oriented perpendicularly to the lower side of the base.Advantageously, this makes an arrangement of the optoelectroniccomponent on a printed circuit board possible such that a radiationdirection of the optoelectronic component is oriented perpendicularly tothe printed circuit board. This makes an especially space-savingarrangement of the optoelectronic component possible.

The base and/or the cap may include steel. Advantageously, the cap andthe base may then be welded to each other in a hermetically sealedmanner.

The cap may include a window. The window may, for example, be glazedinto the cap. A laser beam emitted by the laser chip of theoptoelectronic component may thereby escape from the housing of theoptoelectronic component via the window of the cap.

The cap may be welded to the base. Advantageously, the laser chip of theoptoelectronic component arranged between the cap and the base isthereby protected from moisture and contamination.

Our optoelectronic device includes a printed circuit board and anoptoelectronic component of the aforementioned kind. In this case, theoptoelectronic component is arranged on a surface of the printed circuitboard. Advantageously, the optoelectronic component may have beenarranged and electrically contacted on the surface of the printedcircuit board via a method of surface mounting. For example, theoptoelectronic component may have been electrically contacted via reflowsoldering. This makes an economical production of the optoelectronicdevice with a high degree of automation possible.

The device may include a plurality of optoelectronic components of theaforementioned kind. In this case, the optoelectronic components arearranged in a series circuit. Advantageously, the optoelectronic devicemay thereby have high optical output power. Due to the possibility ofarranging the optoelectronic components on the surface of the printedcircuit board via a method of surface mounting, the individualoptoelectronic components may be densely packed on the surface of theprinted circuit board. This advantageously makes it possible for theoptoelectronic device to have compact exterior dimensions.

One method of producing an optoelectronic device includes the steps ofproviding a printed circuit board, providing an optoelectronic componentof the aforementioned kind, and arranging the optoelectronic componenton a surface of the printed circuit board. Advantageously, arrangementof the optoelectronic component on the surface of the printed circuitboard may be carried out in an automated manner, for example, with theaid of an SMT placement machine. Arrangement of the optoelectroniccomponent on the surface of the printed circuit board may be carried outin a joint operation with an arrangement of additional components on thesurface of the printed circuit board. As a result, the method may beadvantageously carried out in an economical manner.

The optoelectronic component may be arranged on the surface of theprinted circuit board with the aid of surface mounting.

The optoelectronic component may be arranged on the surface of theprinted circuit board with the aid of reflow soldering. In this case, aself-centering of the optoelectronic component may be advantageouslycarried out. In this case, the optoelectronic component is preciselyself-oriented in its target position via surface tension during themelting of solder.

The characteristics, features, and advantages described above, as wellas the manner in which they are achieved, will be more clearly andexplicitly understandable in connection with the following descriptionof the examples which are explained in greater detail in connection withthe drawings.

FIG. 1 shows a schematic perspective view of a base 200 of a housing 110of an optoelectronic component 100. FIG. 2 shows a schematic perspectiveview of a cap 300 of the housing 110 of the optoelectronic component100. FIG. 3 shows a schematic perspective view of the housing 110 of theoptoelectronic component 100, in which the base 200 and the cap 300 ofthe housing 110 are joined.

The optoelectronic component 100 may, for example, be a laser component.For example, the optoelectronic component 100 may be a laser componentthat emits a laser beam having a wavelength in the shortwave visiblespectral range.

The base 200 of the housing 110 of the optoelectronic component 100 mayalso be referred to as the header. The base 200 includes an electricallyconductive material, preferably a metal. The base 200 may, for example,include an iron or nickel alloy. For example, the base 200 may includesteel.

The base 200 has an upper side 201 and a lower side 202 opposite theupper side 201. In the example shown in FIG. 1, the base 200 has anapproximately rectangular basic shape that makes it possible to denselypack the housing 110 of the optoelectronic component 100 including thebase 200 next to additional identical housings 110 of additionaloptoelectronic components 100. However, the base 200 could, for example,also have a circular disk-shaped basic shape or a hexagonal basic shape.

An electrically conductive pin 260 embedded in the base 200 extends fromthe lower side 202 of the base 200 through the base 200, and beyond theupper side 201 of the base 200. In this case, a portion of theelectrically conductive pin 260 projecting beyond the upper side 201 ofthe base 200 is oriented perpendicularly to the upper side 201 of thebase 200. The electrically conductive pin 260 includes an electricallyconductive material, for example, a metal. The electrically conductivepin 260 may include the same material as the remaining sections of thebase 200.

The electrically conductive pin is electrically insulated from theremaining sections of the base 200 with the aid of an insulator 265. Theinsulator 265 may, for example, be formed as glazing. Preferably, theelectrically conductive pin 260 is embedded in the base 200 in ahermetically sealed manner via the insulator 265.

A platform 230 is formed on the upper side 201 of the base 200 of thehousing 110 of the optoelectronic component 100. The platform 230 mayalso be referred to as a pedestal. The platform 230 may be formed ofuniform material integrally connected to the remaining sections of thebase 200. In any case, the platform 230 includes an electricallyconductive material and electrically conductively connects to thoseportions of the base 200 which are electrically insulated from theelectrically conductive pin 260. The platform 230 has a chip mountingsurface 235 preferably oriented approximately perpendicularly to theupper side 201 of the base 200 and thus also perpendicularly to thelower side 202 of the base 200.

The optoelectronic component 100 includes a laser chip 400. The laserchip 400 is a semiconductor-based laser diode. The laser chip 400 emitsa laser beam. For example, the laser chip 400 may emit a laser beamhaving a wavelength in the shortwave visible spectral range, forexample, a laser beam having a wavelength in the blue spectral range.

The laser chip 400 has an upper side 401 and a lower side 402 oppositethe upper side 401. A first electrical contact pad 410 is formed on theupper side 401 of the laser chip 400. A second electrical contact pad420 is formed on the lower side 402 of the laser chip 400. Duringoperation of the laser chip 400, an electrical voltage may be applied tothe laser chip 400 between the first electrical contact pad 410 and thesecond electrical contact pad 420 of the laser chip 400.

The laser chip 400 of the optoelectronic component 100 is positioned onthe chip mounting surface 235 of the platform 230 of the base 200 of thehousing 110 of the optoelectronic component 100 such a way that aradiation direction 430 of the laser chip 400 is oriented approximatelyperpendicularly to the upper side 201 of the base 200 and thus alsoperpendicularly to the lower side 202 of the base 200. During operationof the laser chip 400, it radiates a laser beam in the radiationdirection 430.

In the example of FIG. 1, the radiation direction 430 of the laser chip400 is oriented parallel to the upper side 401 of the laser chip 400.The laser chip 400 is an edge emitter. However, it is also possible todesign the laser chip 400 as a surface emitter. In this case as well,the laser chip 400 should be positioned on the platform 230 of the base200 of the housing 110 of the optoelectronic component 100 such that theradiation direction 430 of the laser chip 400 is orientedperpendicularly to the upper side 201 and thus also perpendicularly tothe lower side 202 of the base 200. The platform 230 may then optionallybe omitted.

The laser chip 400 is arranged on a carrier 240. The carrier 240 mayalso be referred to as a submount. The carrier 240 preferably includesan electrically insulating and thermally highly conductive material. Anelectrically conductive metalization is arranged on an upper side of thecarrier 240. The laser chip 400 is arranged on the upper side of thecarrier 240 such that the lower side 402 of the laser chip 400 faces theupper side of the carrier 240. In this case, the second electricalcontact pad 420 of the laser chip 400 formed on the lower side 402 ofthe laser chip 400 makes an electrically conductive connection with theelectrically conductive metalization on the upper side of the carrier240.

The carrier 240 is arranged on the chip mounting surface 235 of theplatform 230 of the base 200 such that a lower side of the carrier 240opposite the upper side of the carrier 240 faces the chip mountingsurface 235. In this case, a thermally highly conductive connectionpreferably exists between the carrier 240 and the platform 230.

The first electrical contact pad 410 of the laser chip 400 formed on theupper side 401 of the laser chip 400 electrically conductively connectsto the electrically conductive pin 260 with the aid of a plurality offirst bonding wires 215. The electrically conductive metalization on theupper side of the carrier 240 electrically conductively connects to theplatform 230 of the base 200 and thus also electrically conductivelyconnects to those sections of the base 200 that are electricallyinsulated from the electrically conductive pin 260, with the aid of aplurality of second bonding wires 225. Since the metalization formed onthe upper side of the carrier 240 electrically conductively connects tothe second electrical contact pad 420 on the lower side 402 of the laserchip 400, an electrically conductive connection thus exists between thesecond electrical contact pad 420 of the laser chip 400 and the sectionsof the base 200 that are electrically insulated from the electricallyconductive pin 260.

It is also possible to form the carrier 240 from electrically conductivematerial. In this case, an electrically conductive metalization on theupper side of the carrier 240 may be omitted. The laser chip 400 isarranged on the upper side of the carrier 240 such that the secondelectrical contact pad 420 formed on the lower side 402 of the laserchip 400 electrically conductively connects to the carrier 240. Thecarrier 240 is situated on the chip mounting surface 235 of the platform230 such that the carrier 240 electrically conductively connects to theplatform 230. In this case, the second bonding wires 225 may be omitted.

It is also possible to completely omit the carrier 240. In this case,the laser chip 400 is situated directly on the chip mounting surface 235of the platform 230 such that the lower side 402 of the laser chip 400faces the chip mounting surface 235, and the second electrical contactpad 420 formed on the lower side 402 of the laser chip 400 makes anelectrically conductive connection with the platform 230. In this caseas well, the second bonding wires 225 may be omitted.

A cavity 250 is arranged on the upper side 201 of the base 200. Thecavity 250 is formed as a recess in the upper side 201 of the base 200.The cavity 250 may be used to accommodate a photodiode. The photodiodemay be provided to detect laser light emitted by the laser chip 400.However, the photodiode may also be omitted. The cavity 250 may thenalso be omitted.

In FIG. 3, the lower side 202 of the base 200 of the housing 110 of theoptoelectronic component 100 is visible. The lower side 202 of the base200 is essentially flat. A first solder contact pad 210 and a secondsolder contact pad 220 are formed on the lower side 202 of the base 200.The first solder contact pad 210 and the second solder contact pad 220are arranged in a common plane. The first solder contact pad 210 isformed on the longitudinal end of the electrically conductive pin 260and electrically conductively connected to it. The second solder contactpad 220 encloses the first solder contact pad 210 in a ring-like mannerand electrically conductively connects to those sections of the base 200that are electrically insulated from the electrically conductive pin260.

The first solder contact pad 210 and the second solder contact pad 220of the base 200 of the housing 110 of the optoelectronic component 100are suitable for surface mounting, for example, surface mounting viareflow soldering.

The cap 300 of the housing 110 of the optoelectronic component 100 maybe made, for example, from a deep-drawn steel sheet.

The cap 300 is designed to be arranged on the upper side 201 of the base200 of the housing 110 of the optoelectronic component 100 such that theplatform 230 and the laser chip 400 arranged on the chip mountingsurface 235 of the platform 230 may be covered by the cap 300.Preferably, the laser chip 400 is sealed off from the surroundings ofthe housing 110 of the optoelectronic component 100 in a hermeticallysealed manner. The laser chip 400 is thereby protected from moisture andcontamination. As a result, a service life of the laser chip 400 andthus a service life of the overall optoelectronic component 100 mayincrease.

The cap 300 may be connected to the base 200 of the housing 110 with theaid of a weld connection 320. The weld connection 320 between the cap300 and the base 200 of the housing 110 of the optoelectronic component100 may, for example, be established via pulse welding. The cap 300 mayhave an annular edge on its side facing the upper side 201 of the base200, which is melted during the production of the weld connection 320.

The cap 300 has a window 310 arranged such that a laser beam emitted bythe laser chip 400 of the optoelectronic component 100 may escape fromthe housing 110 of the optoelectronic component 100 through the window310 if the laser chip 400 is covered by the cap 300. For this purpose,the window 310 includes a material essentially transparent to laserradiation emitted by the laser chip 400. Preferably, the window 310 isglazed into the cap 300 in a hermetically sealed manner.

FIG. 4 shows a schematic perspective view of a printed circuit board 600of an optoelectronic device 500. The optoelectronic device 500 may, forexample, be a laser device.

The printed circuit board 600 has a surface 601 and a rear side 602opposite the surface 601. In the example shown in FIG. 4, the printedcircuit board 600 is designed as a DCB (direct copper bonding) printedcircuit board and includes a layer composite made up of copper, aninsulator, and an additional layer of copper. The insulator may, forexample, include aluminum oxide or aluminum nitride. However, theprinted circuit board 600 can also be an FR4 printed circuit boardhaving integrated thermal vias or a metal-core printed circuit board.

In the example depicted in FIG. 4, five series-circuit strings 630 arearranged on the surface 601 of the printed circuit board 600, each beingprovided to accommodate five optoelectronic components 100. Of course,the printed circuit board 600 can also include a different number ofseries-circuit strings 630. The series-circuit strings 630 can alsoaccommodate fewer or more than five optoelectronic components 100 each.

Each series-circuit string 630 has a plurality of first mating contactpads 610 and second mating contact pads 620 formed in a metalization onthe surface 601 of the printed circuit board 600. Each second matingcontact pad 620 of a series-circuit string 630, up to the last secondmating contact pad 620 of each series-circuit string 630, is formed asone piece integrally connected to a subsequent first mating contact pad610 of the same series-circuit string 630. Conversely, each first matingcontact pad 610 of a series-circuit string 630, up to the first matingcontact pad 610 of each series-circuit string 630, also integrallyconnects as one piece to each preceding second mating contact pad 620 ofthe same series-circuit string 630. The first mating contact pad 610 ofeach series-circuit string 630 electrically conductively connects to afirst outer connecting area 615 of each series-circuit string 630. Thelast second mating contact pad 620 of each series-circuit string 630electrically conductively connects to a second outer connecting area 625of each series-circuit string 630.

FIG. 5 shows a schematic perspective view of the printed circuit board600 of the optoelectronic device 500 including optoelectronic components100 arranged on it. FIG. 6 shows a schematic cut-away view of a portionof the printed circuit board 600 and the optoelectronic components 100of the optoelectronic device 500.

Five optoelectronic components 100 are arranged on each of the fiveseries-circuit strings 630 of the printed circuit board 600. In thiscase, each optoelectronic component 100 is arranged such that the lowerside 202 of the base 200 of the housing 110 of each optoelectroniccomponent 100 faces the surface 601 of the printed circuit board 600 ofthe optoelectronic device 500. The first solder contact pad 210 on thelower side 202 of the base 200 of the housing 110 of each optoelectroniccomponent 100 electrically conductively contacts a first mating contactpad 610 of the printed circuit board 600. The second solder contact pad220 on the lower side 202 of the base 200 of the housing 110 of eachoptoelectronic component 100 electrically conductively connects to asecond mating contact pad 620 on the surface 601 of the printed circuitboard 600. As a result, the optoelectronic components 100 of eachseries-circuit string 630 electrically connect in series.

The optoelectronic components 100 have been arranged on the surface 601of the printed circuit board 600 via a method of surface mounting. Forexample, the optoelectronic components 100 may have been arranged on thesurface 601 of the printed circuit board 600 via reflow soldering.

Electrically conductive solder is arranged between the first soldercontact pad 210 of each optoelectronic component 100 and the associatedfirst mating contact pad 610 of the printed circuit board 600.Correspondingly, solder is also arranged between the second soldercontact pad 220 of each optoelectronic component 100 and the associatedsecond mating contact pad 620 of the printed circuit board 600.

A solder resist is arranged in the transition areas between the secondmating contact pads 620 and each of the subsequent first mating contactpads 610 of each series-circuit string 630 of the printed circuit board600, as well as in the transition area between the first outerconnecting area 615 and the subsequent first mating contact pad 610 ofeach series-circuit string 630, which solder resist electricallyinsulates each section of the first mating contact pad 610 from thesecond solder contact pad 220 of each associated optoelectroniccomponent 100.

To install the optoelectronic components 100 on the surface 601 of theprinted circuit board 600 of the optoelectronic device 500, solder pasteis first arranged on the mating contact pads 610, 620 on the surface 601of the printed circuit board 600. The solder paste comprises solderballs, flux, and solvent. Simultaneously, solder resist is provided atthe aforementioned areas of the first mating contact pads 610. Thearrangement of the solder paste and the solder resist may, for example,be carried out via screen or stencil printing. The solder resist mayalso already be applied during production of the printed circuit boardand may be structured via photopatterning. Subsequently, theoptoelectronic components 100 are arranged on the surface 601 of theprinted circuit board 600. This may, for example, be carried out withthe aid of an SMT placement machine. Subsequently, the optoelectroniccomponents 100 are soldered on in a reflow oven or vapor phase oven.Subsequently, the optoelectronic device 500 may be washed to removeexcess flux.

Simultaneously with the arrangement of the optoelectronic components 100on the surface 601 of the printed circuit board 600, other componentsmay be arranged on the surface 601 of the printed circuit board 600 andelectrically conductively connected to it.

In each series-circuit string 630 of the optoelectronic device 500, anelectrical voltage may be applied between the first outer connectingarea 615 and the second outer connecting area 625 to operate theoptoelectronic components 100 of each series-circuit string 630.

During operation of the optoelectronic device 500, waste heataccumulates in the laser chips 400 of the optoelectronic components 100.The waste heat accumulating in the laser chips 400 at eachoptoelectronic component 100 may dissipate into the base 200 of eachoptoelectronic component 100 via the lower side 402 of the laser chip400 and the carrier 240. The waste heat may dissipate from the base 200into the printed circuit board 600, via the first solder contact pad 210and the second solder contact pad 220 on the lower side 202 of the base200 of each optoelectronic component 100, the solder connections betweenthe solder contact pads 210, 220 and the mating contact pads 610, 620 ofthe printed circuit board 600, and the mating contact pads 610, 620 ofthe printed circuit board 600. In this case, dissipation of the wasteheat arising in the optoelectronic components 100 is supported via theextensive contact between the lower side 202 of the base 200 of eachoptoelectronic component 100 and the surface 601 of the printed circuitboard 600. The solder connections between the solder contact pads 210,220 of the optoelectronic components 100 and the mating contact pads610, 620 of the printed circuit board 600 advantageously have only aslight thermal resistance.

Our components, devices and methods have been illustrated and describedin greater detail based on preferred examples. However, this disclosureis not limited to the examples. Rather, other variations may be derivedfrom them by those skilled in the art without departing from the scopeof protection of the appended claims.

The application claims priority of DE 10 2013 217 796.8, the subjectmatter of which is incorporated herein by reference.

The invention claimed is:
 1. An optoelectronic component comprising: ahousing comprising a base having an upper side and a lower side, and acap, and a laser chip arranged between the upper side of the base andthe cap, wherein a first solder contact pad and a second solder contactpad are formed on the lower side of the base, the laser chip includes asecond electrical contact pad, and the second electrical contact padelectrically conductively connects to a section of the base electricallyconductively connected to the second solder contact pad by a secondbonding wire.
 2. The optoelectronic component as claimed in claim 1,wherein an electrically conductive pin extends between the upper sideand the lower side through the base, the pin is electrically insulatedfrom the remaining sections of the base, and the pin electricallyconductively connects to the first solder contact pad.
 3. Theoptoelectronic component as claimed in claim 2, wherein the laser chipincludes a first electrical contact pad, and the first electricalcontact pad electrically conductively connects to the pin with the aidof a first bonding wire.
 4. The optoelectronic component as claimed inclaim 1, wherein the second solder contact pad encloses the first soldercontact pad in a ring shape.
 5. The optoelectronic component as claimedin claim 1, wherein a platform is formed on the upper side of the base,and the laser chip is arranged on the platform.
 6. The optoelectroniccomponent as claimed in claim 1, wherein the laser chip is arranged suchthat a radiation direction of the laser chip is oriented perpendicularlyto the lower side of the base.
 7. The optoelectronic component asclaimed in claim 1, wherein the base and/or the cap include(s) steel. 8.The optoelectronic component as claimed in claim 1, wherein the capincludes a window.
 9. The optoelectronic component as claimed in claim1, wherein the cap is welded to the base.
 10. An optoelectronic devicecomprising: a printed circuit board, and the optoelectronic component asclaimed in claim 1, wherein the optoelectronic component is arranged ona surface of the printed circuit board.
 11. The optoelectronic device asclaimed in claim 10, wherein the optoelectronic device includes aplurality of optoelectronic components comprising: a housing comprisinga base having an upper side and a lower side, and a cap, and a laserchip arranged between the upper side of the base and the cap, wherein afirst solder contact pad and a second solder contact pad are formed onthe lower side of the base, the laser chip includes a second electricalcontact pad, the second electrical contact pad electrically conductivelyconnects to a section of the base electrically conductively connected tothe second solder contact pad by a second bonding wire, and theoptoelectronic components are arranged in a series circuit.
 12. A methodof producing an optoelectronic device comprising: providing a printedcircuit board; providing the optoelectronic component as claimed inclaim 1; and arranging the optoelectronic component on a surface of theprinted circuit board.
 13. The method as claimed in claim 12, whereinthe optoelectronic component is arranged on the surface of the printedcircuit board by surface mounting.
 14. The method as claimed in claim13, wherein the optoelectronic component is arranged on the surface ofthe printed circuit board by reflow soldering.